Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 ...
Silicon Motion Technology Corporation (NasdaqGS: SIMO) ('Silicon Motion” or the 'Company”), a global leader in NAND flash controllers for solid state storage devices, plans to release its fourth ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
Based on the NXP energy efficient i.MX 91 processor, the SRG091X integrates the NXP IW610G, delivering Wi-Fi 6 in the 2.4GHz ...
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today unveiled its SRG091X and SRG093X series modules at CES in Las Vegas, delivering integrated CPU, memory and wireless ...
We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...
Teledyne HiRel Semiconductors has released an industrial-grade embedded multimediacard (eMMC) module. The device provides 128GB of eMMC 5.1-compliant storage in a 153-ball FBGA package designed for ...
1 National Space Science Center, The Chinese Academy of Sciences, Beijing, China 2 University of Chinese Academy of Sciences, Beijing, China This paper primarily introduces a novel on-board ...
As NAND leaders recalibrate production allocation, Taiwan's Winbond Electronics and Macronix International are doubling down on specialized segments. Both are expanding their presence in embedded and ...
Teledyne HiRel Semiconductors announced the release of industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The DL Technology X-Form needles are custom ...
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