M5 Pro chip could separate CPU and GPU

Apple insider and analyst Ming-Chi Kuo has revealed a slew of new information about Cupertino's upcoming M5-series processors ...
Apple's new M5 Pro, M5 Max, and M5 Ultra chips will reportedly use server-grade SoIC packaging, with the iPhone giant to use ...
A long-time Apple Insider, Ming-Chi Kuo @mingchikuo on X, has leaked some juicy details on the company's next-gen M5 series of processors, particularly the M5 Pro, M5 Max, and M5 Ultra.
In a blog post on Medium, Apple insider Ming-Chi Kuo revealed interesting details about Apple's future iPhone 18 and M5 Mac ...
Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming ...