Fan-out wafer-level packaging (FOWLP) is commonly used for manufacturing system-in-package components and multi-chip modules, where multiple integrated circuit dice can be combined in a common, ...

Abstract: It is difficult for a standing-wave waveguide slot array antenna to generate a complex beam shape in H-plane, such as the cosecant squared pattern. The reason is that a conventional standing ...

Velo3D [VELO], a developer of medal additive manufacturing solutions used in aerospace, defense and other industries, won a $32.6 million contract from the Defense Innovation Unit (DIU) to help the ...

Can you chip in? As an independent nonprofit, the Internet Archive is fighting for universal access to quality information. We build and maintain all our own systems, but we don’t charge for access, ...