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MIT’s chip stacking leap could slash energy use for hungry AI chips

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
IEEE

3-D Vertical Resistive Switching Random Access Memory (3D-VRRAM) With Multilevel Programming for High-Density, Energy-Efficient In-Memory Computing

Abstract: Resistive random access memory (RRAM) devices offer a broad range of attractive properties for in-memory computing (IMC) applications, such as nonvolatile storage, low read current, and high ...