Innodisk has launched its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI ...

Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

The Galaxy S26 Ultra is expected to pack refinements in performance, display tech, camera software, and design language while ...

Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, ...

GDU debuted the UAV-P300 at CES 2026, touting AI-driven fog penetration, a 50MP sensor, 4K night vision, thermal imaging, and ...

See it as part of Qualcomm’s technology showcase at NRF 2026, January 11–13, 2026, at the Javits Center, NYC, Booth ...

Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...

At CES 2026, AI is having some of its most significant impact on everyday, existing products, from TVs to PCs, smartphones to ...

On the same day, Lantronix Inc. (NASDAQ:LTRX) announced a collaboration with Trillium Engineering to integrate its Edge AI ...

The AI Dashcam Plus doubles as a hands-free communications tool. Dispatchers can use it to notify drivers about issues such ...

Apple's iPhone development roadmap runs several years into the future and the company is continually working with suppliers ...