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Abstract: To maintain high-performance computing capacity and prevent chip overheating, it is essential to minimize the gap between on-die thermal measurements and the actual temperature at hotspots.
Abstract: The world’s smallest HDR voltage-domain global shutter (VDGS) image sensor with 2.2μm pixel pitch was fabricated based on a 2-layer stacking process with Cu-to-Cu wafer bonding process. The ...
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