Microsoft has unveiled an in-chip microfluidic cooling system that channels coolant through microscopic pathways etched into the silicon itself—delivering up to three times greater heat removal than ...

David S. Hage shares how his team is applying microfluidics and miniaturized separation systems to improve speed, reproducibility, and real-world applicability in analytical and bioanalytical ...

Microsoft engineers have developed a microfluidics chip-cooling technique that removes heat more efficiently and could ratchet down heat generated by AI workloads. When you purchase through links on ...

One of the major reasons why AI data centers are sucking up so much power is the need to cool processors that run very hot. But Microsoft is trying out a possible solution: sending fluid directly ...

It is a now well-known fact in the datacenters of the world, which are trying to cram ten pounds of power usage into a five pound bit barn bag, that liquid cooling is an absolute necessity for the ...

Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company states that the ...

Figuring out how to keep a chip cool is one of the biggest challenges to designing a more powerful and sustainable chip. Microsoft says it’s making progress on a new solution. Figuring out how to ...

The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...

Forward-looking: Microsoft has taken a significant step toward addressing the thermal challenges of next-generation data processing hardware. The company has developed an in-chip microfluidic cooling ...

Microsoft reported today it has successfully tested a new cooling system that removed heat up to three times better than cold plates. The system is called microfluidics, an approach that brings liquid ...

The microfluidic cooling system tested by Microsoft promises up to 3x better heat removal than cold plates, improved power usage, and reduced operational costs. Microsoft has announced a new cooling ...