Abstract: Next-generation power modules require rigorous evaluation of insulating substrates due to increasing voltage levels and the associated risk of partial discharge (PD). PD typically occurs in ...
Abstract: As the development speed of Moore's Law slows down, advanced packaging has emerged as a pivotal approach to enhancing chip performance, yet the accompanying thermal management challenges ...
The iPhone 18 Pro is nowhere near release, but plenty of claims have already been made about Apple's next flagship. Here's what the rumor mill thinks is coming. With its 2025 iPhone lineup, Apple's ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback