Abstract: Custom high bandwidth memory (HBM) directly connects the DRAM die stacks to the logic die vertically. The bottom logic die functions as both the logic and the buffer die. The 3D stacking of ...
Abstract: 2.5D packaging supports high-speed data transmission, meeting performance requirements of GPU. However, signal integrity (SI) is a key challenge to packaging. This paper demonstrates a GPU ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback