The most durable tech is boring, old, and everywhere

Opinion: From COBOL and C to Linux and SQL, the unglamorous software that keeps the world running refuses to disappear ...
IEEE

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFET CMOS Logic Process

Abstract: This study introduces a breakthrough achievement of 0.1-Gb/mm2 wing-shaped high-density embedded 3-D via resistive random access memory (Via RRAM) in TSMC’s 16-nm FinFET CMOS logic process.
IEEE

Stimulating Diffusion Model for Image Denoising via Adaptive Embedding and Ensembling

Abstract: Image denoising is a fundamental problem in computational photography, where achieving high perception with low distortion is highly demanding. Current methods either struggle with ...