Each die is flanked by four blocks of high-bandwidth memory (hbm) chips that together store 192 gigabytes of data. The ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

In the 2000s, software companies like Google, Microsoft and Meta were content with the incremental processing gains that ...

It was devised to afford members the ability to mix and match chiplet components from multiple vendors, and to facilitate and ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data ...

SiFive, having designed RISC-V CPU cores for various AI chips, is now offering to license the blueprints for its own ...

Data movement is becoming a bigger problem at advanced nodes and in advanced packaging due to denser circuitry, more physical ...

It was crafted by Marilou Schultz based off a photo of the chip die, which she split into 64 sections. Schultz utilized what's called a "raised outline" method to give the rug a three-dimensional ...

This use case also scales equally well to a case of multiple AI Chiplets within a single die with the difference there being the type of Serdes being used. Short distances in the chip matrix require a ...

Berry disclosed some of the details about the Telum II chip, including its on-die DPU, and also revealed that IBM is indeed going to commercialize the AI Acceleration Unit, or AIU, which was developed ...

Here are three blue-chip stocks long-term investors may want to consider, given their penchant for growth amid market share dominance. Finding the right blue-chip stocks to own for the long term ...