The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...

COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...

Multiphysics simulation allows engineers to evaluate complex interactions in a single environment, reducing the need for physical prototypes. In healthcare, simulation helped design electromagnetic ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...

COMSOL Multiphysics is a comprehensive simulation software platform that enables engineers and scientists to model and analyze multidisciplinary physical systems. By integrating multiple fields of ...

Fluorocarbons, which are widely used in refrigeration, air conditioning, foam insulation, and fire suppression, are potent greenhouse gases. Despite international regulations under the Montreal ...

Aug 1 (Reuters) - A federal appeals court on Friday rejected challenges by refrigerant manufacturers to a rule adopted during Democratic President Joe Biden's administration to curtail the use of a ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...