Abstract: The ever-increasing demand for affordable, compact, and integrated sensors necessitates innovations that outperform traditional, bulkier counterparts. This paper introduces an advanced ...
As such, Roumen doesn't hold back on the software he's happy to embrace, which includes the works all the best 3D modelling ...
Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
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