Summary Canon's nanoimprint lithography, unveiled in September, offers a game-changing alternative to EUV lithography. By directly stamping circuit patterns on silicon wafers, it reduces power usage, ...

Microsoft expects to spend $80 billion on AI-enabled data centers in fiscal 2025: Summary Microsoft plans to invest $80 billion in fiscal 2025 to expand AI-focused data centers, w ...

Summary TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains ...

In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the long-term ...

Summary The U.S. launched a Section 301 investigation into China’s alleged dumping of mature-node chips, citing unfair trade practices. Analysts warn China's growing capacity could dominate global ...

Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT.

TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT ...

The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances AI efficiency and reliability while addressing semiconductor scaling and data transmission challenges ...

The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import restrictions, ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

The Arm vs. Qualcomm trial has concluded, with the jury now deliberating after closing arguments. TIRIAS Research analysts Jim McGregor and Francis Sideco share courtroom insights, analyzing the ...