Abstract: SiC devices possess characteristics such as high voltage resistance, low loss, and high thermal conductivity, making them highly advantageous for applications in smart grids, new energy ...
Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...
With one ceremonial shovel swing during a Dec. 12, 2025, groundbreaking ceremony, the U.S. Army Corps of Engineers (USACE) is ...
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