AI approach takes optical system design from months to milliseconds

A team of researchers at Penn State have devised a new, streamlined approach to designing metasurfaces, a class of engineered ...
Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Tech Xplore on MSN

Energy system optimization model developed for pathways to net-zero greenhouse gas emissions for Southeast Asia

Could Southeast Asia become carbon neutral by 2050, even as energy demand increases? The region is growing quickly and still ...
Modern Machine Shop

Concepts NREC Software Suite Enhances Turbomachinery Design, Manufacturing

Concepts NREC introduces Agile Engineering Design System v2025.2 with advanced volute modeling, secondary flow capabilities ...