Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
'It will increase the contribution to gratuity, which is something the employer has to give.' Illustration: Dominic Xavier/Rediff Days after the Centre notified the long-pending four labour Codes, the ...
Abstract: We present VC3, the first system that allows users to run distributed MapReduce computations in the cloud while keeping their code and data secret, and ensuring the correctness and ...
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