OpenJDK project teams will focus work on features such as value types, code reflection, AOT compilation, and structured ...

Abstract: Chip embedding power modules are a promising solution for multilevel converter implementation due to their high level of integration, thermal performance, and low parasitic inductance ...

Abstract: The calculation of the eddy current field in the motional scenario is a difficult problem. Due to the movement of conductors, the original mesh may be largely deformed. For engineering ...

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