A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...
A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Scientists from the UKAEA, JKU Linz, and Emmi AI have developed an AI tool called GyroSwin that can perform complex 5D plasma ...
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