Abstract: The ever-increasing demand for affordable, compact, and integrated sensors necessitates innovations that outperform traditional, bulkier counterparts. This paper introduces an advanced ...
Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
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