It tackles the long-standing problem of signal failure in flexible electronics caused by bending, movement, and environmental ...
Washington State University researchers 3D print antenna arrays for flexible wireless systems using copper nanoparticles.
Washington State University-led researchers have developed a chip-sized processor and 3D printed antenna arrays that could ...
Abstract: In this letter, a general design criterion is proposed for optimizing non-uniform three-dimensional (3D) arrays to enhance near-field capacity in extremely large-scale MIMO (XL-MIMO) ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...