Design And Reuse

Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring

On April 9, 2026, SiFive announced the completion of a $400 million oversubscribed Series G financing, and NVIDIA appeared on the list of investors. What's more notable is not the financing amount, ...
Design And Reuse

GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution

GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO). GF’s SCALE solution, or Silicon photonics Co-packaged Advanced ...
Design And Reuse

Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC

Apple is considering shifting part of its semiconductor foundry production away from Taiwan Semiconductor Manufacturing Co. to alternative suppliers including Samsung Electronics and Intel, according ...
Design And Reuse

The Next Phase of Europe’s Semiconductor Strategy

Across Europe’s semiconductor debate, the narrative is shifting from urgency to realism. In the following three articles, we examine how the European Union is recalibrating its chip strategy as ...
Design And Reuse

QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge

QuickLogic Corporation (NASDAQ: QUIK) will showcase its EOS™ S3 SoC and eFPGA solutions at Sensors Converge 2026, taking place at the Santa Clara Convention Center. Attendees can visit Booth 1039 to ...
Design And Reuse

Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies

Joint Innovation Laboratory strengthens charging validation, standards development, and global compliance for new energy vehicles ...
Design And Reuse

AI demand reshapes semiconductor capacity and intensifies supply chain competition

As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly ...
Design And Reuse

SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification

The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, today announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives. This ...
Design And Reuse

Analysts bullish on SkyeChip ahead of IPO, upside seen at up to 91%

Analysts are bullish on Main Market-bound SkyeChip Bhd ahead of its listing,highlighting its scalable silicon intellectual property (IP) licensing model and exposure to artificial intelligence ...
Design And Reuse

Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration

Addresses 128 GT/s receiver validation challenges for next-generation compute, AI, and data center applications ...
Design And Reuse

Omni Design Technologies Steps Up European Hiring and Advanced Data Center IP Push

Omni Design Technologies is an analog and mixed-signal IP provider, and this weekly recap highlights a strategic expansion of its engineering and product footprint. The company is actively recruiting ...
Design And Reuse

Lenovo’s New ThinkPad Headset Uses Ceva Spatial Audio to Make Entertainment Content More Immersive and Drive All-Day Use

ThinkPad Headset 8550 (Aura Edition) powered by Ceva RealSpace® delivers low-latency, head-tracked spatial audio to enhance immersion across music, video and gaming, extending usage beyond conference ...