Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...

AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

Carefully managing the operating conditions of logic cells and embedded memories directly impacts power consumption.

A new technical paper titled “An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures” was ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes them an integral part of any neural network, but nonlinear functions can ...

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product ...