As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

As businesses grow, manual packaging can create bottlenecks that limit revenue potential. Automating your packaging line ...

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...

Frequently employed in the automotive industry, among others, the eight disciplines problem solving (8D) methodology is a quality practice aimed at product and process improvement that can help ...