MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages, that also features side-wettable flanks to support automated ...
The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications ...
These miniaturised logic ICs are essential for space constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, ...
mount diodes, semiconductor manufacturer TT electronics Semelab has developed a series of ceramic diode leadless chip carrier devices for military, aerospace, avionics and high-temperature ...
Nexperia has brought out a portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB ...
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