Another common mistake is simply reducing the diameter of the through-holes to permit space to reroute the breakout. To maintain manufacturability, I recommend a minimum 6mil finished hole size/8mil ...
In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...
A new technical paper titled “Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node” was published by researchers at Samsung ...
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