Housed in QFN packages, the 24-bit MSC1201 and MSC1202 precision data acquisition chips integrate a low-noise delta-sigma A/D converter, an enhanced 8051 processor core, 4 or 8 Kbytes of flash memory, ...
The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.
The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...
SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
ANDOVER, Mass., Aug. 27, 2010 (GLOBE NEWSWIRE) -- SiGe Semiconductor, Inc., a leading supplier of silicon-based radio frequency (RF) power amplifiers (PAs) and front end modules (FEMs), has further ...
Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...
BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Ironwood Electronics’ SG-MLF-7079 elastomer socket, operating at bandwidths up to 10 GHz with less than 1 dB of insertion loss, is designed for an 8- by 8- by-0.8-mm, 0.5-mm-pitch quad flat no-lead ...
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