Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for ...

Shares of BOE Technology Group rose by the exchange-imposed daily trading limit after the Chinese display panel giant said it ...

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company ...

USA, through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

AI workloads are pushing chips to their physical limits. Glass substrates and silicon photonics promise higher interconnect ...

India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha Chief Minister Mohan Majhi laying the foundation stone for the country’s first glass ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...