Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, ...

Master Bond Inc offers the widest selection of compounds and the technical expertise to help you meet your potting and encapsulation needs. From relays, connectors and power supplies to surge ...

It is 100% reactive and contains no volatiles. The compound generates low exotherm during cure even though it cures relatively quickly at room temperature. Its cure shrinkage is low and it bonds to ...