The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

PTAG to acquire Construct-X, uniting leaders in AWP and digital project delivery to transform industrial capital projects through innovation and collaboration. PTAG and Construct-X, bringing together ...

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

98% of megaprojects face cost overruns or delays, costing the U.S. construction industry $280 billion annually. On the latest Disruption Interruption episode, Olfa Hamdi, CEO of Concord Project ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

TSMC’s advanced packaging capacity is fully booked until 2025 due to hyper demand for large, powerful chips from cloud service giants like Amazon AWS, Microsoft, Google, and Meta. Nvidia and AMD are ...

TORONTO, April 15, 2025 /PRNewswire/ - PTAG Inc. ("PTAG") and Intelligent Construction Experts, LLC, doing business as Construct-X ("Construct-X"), are pleased to announce that they have entered into ...