Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

New chip to be faster and more power-efficient. May 5, 2011— -- In today's TechBytes: a significant development in computer chip design. Intel has unveiled a three-dimensional chip with a ...

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable ...

A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...

Forward-looking: Researchers at the University of Massachusetts Amherst have developed a laser-based technique to align 3D semiconductor chips, potentially overcoming a longstanding challenge in chip ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...